In chip manufacturing, the wafer is the core raw material of the chip, and the laser cutting machine can well meet the requirements of wafer cutting, which can effectively avoid the problems of grinding wheel scribing
1. Non contact processing: In laser processing, only the laser beam contacts the workpiece, and no cutting force acts on the cutting workpiece, so as to avoid damage to the surface of processed materials.
2. High processing accuracy and small thermal impact: pulse laser can achieve extremely high instantaneous power, extremely high energy density and very low average power. It can complete processing instantaneously with very small thermal impact area to ensure high-precision processing and small thermal impact area.
3. High processing efficiency and good economic benefits: the laser processing efficiency is often several times the mechanical processing effect, and there is no consumables and no pollution. Laser invisible cutting technology of semiconductor wafer is a new laser cutting process, which has many advantages such as fast cutting speed, no dust generated during cutting, no substrate consumption, small cutting path required, and complete dry process.
The main principle of the laser cutting machine is to focus the short pulse laser beam through the material surface to the middle of the material, form a calcium layer in the middle of the material, and then apply external pressure to separate the chips.
