In the field of chips, China is in a weak position. Many chips need to be imported, which has been restricted by others for a long time and lacks independent intellectual property rights and upstream and downstream industrial chains. In recent years, during the Sino US trade war, the United States imposed sanctions on China on the chip issue, which made us realize the importance of chips. After that, domestic technologies related to chip manufacturing difficulties have been overcome.
China’s information industry has made positive progress in many areas of technology
With the development of 6G communication technology, China has been at the top of the IT industry. It has become the main source country of 6G technology patent applications, ranking first in the world.
Soon, China will also have the ability to manufacture high-end chips. It is believed that with the continuous accumulation of our innovative technologies, the mass production of 7nm chips will soon be realized. Let the technology enterprises such as mobile phones and automobiles that have stopped their development because of chip problems see hope.
What important role does laser cutting machine play in chip manufacturing?
In chip manufacturing, the wafer is the core raw material of the chip, and the laser cutting machine can well meet the requirements of wafer cutting, which can effectively avoid the problems of grinding wheel scribing
Advantages of laser cutting machine wafers:
1. Non contact processing: In laser processing, only the laser beam contacts the workpiece, and no cutting force acts on the cutting workpiece, so as to avoid damage to the surface of processed materials.
2. High processing accuracy and small thermal impact: pulse laser can achieve extremely high instantaneous power, extremely high energy density and very low average power. It can complete processing instantaneously with very small thermal impact area to ensure high-precision processing and small thermal impact area.
3. High processing efficiency and good economic benefits: the laser processing efficiency is often several times the mechanical processing effect, and there is no consumables and no pollution. Laser invisible cutting technology of semiconductor wafer is a new laser cutting process, which has many advantages such as fast cutting speed, no dust generated during cutting, no substrate consumption, small cutting path required, and complete dry process.
The main principle of laser cutting is to focus the short pulse laser beam through the material surface to the middle of the material, form a calcium layer in the middle of the material, and then apply external pressure to separate the chips. Domestic chips can not achieve mass production without the efforts of relevant equipment manufacturers. In the face of technical difficulties, we can break through ourselves and develop our own technology to jump out of the quagmire.
