LCP is a new type of polymer material, known as “the key material to hold the throat of 5G”, and is widely used in the field of 3C electronics. At the beginning of its development, it was often used as a high-temperature resistant material for microwave ovens. With the development of science and technology and the expansion of application fields, LCP has gradually entered people’s The vision of 5G is gradually being applied to the scientific application of 5G.
Common LCP products include electronic component connectors, antenna materials, production connecting tubes and sensors, etc., which are widely used. With the advent of the 5G era, the demand for LCP as an antenna material is greatly increased. Xiaobian today to introduce a LCP material cutting equipment – laser cutting machine. In the 3C field, the cutting requirements for LCP are relatively high, and the traditional cutting methods have gradually been unable to meet the growing scientific and technological requirements. In order to seek the most technological progress, LCP laser cutting machine has entered people’s field of vision, replacing the traditional cutting method.
LCP laser cutting machine cutting advantages?
- Non-contact processing: In laser processing, only the laser beam contacts the workpiece, and no cutting force acts on the workpiece to avoid damage to the surface of the processed material.
- High machining accuracy and small thermal impact: pulsed laser can achieve extremely high instantaneous power, extremely high energy density and low average power, and can complete processing in an instant with a very small heat-affected area, ensuring high-precision machining and small heat-affected area. .
- High processing efficiency and good economic benefits: The laser processing efficiency is often several times that of the mechanical processing effect, and there are no consumables and no pollution. The laser stealth cutting technology of semiconductor wafers is a brand-new laser cutting process, which has many advantages, such as fast cutting speed, no dust generated during cutting, no cutting substrate loss, small required cutting lines, and completely dry process.
