Advantages of laser cutting PI film

PI film is the best film insulating material in the world, which is made of pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) by condensation polymerization in strong polar solvent, tape casting into film, and then amination. Polyimides can be widely used in many fields due to their excellent comprehensive properties and diversity in synthetic chemistry.
What are the advantages of laser cutting PI film?
Advantages of laser cutting PI film, cutting of various film materials in PCB/FPC and other industries:
(1) : The laser cutting speed is fast, the incision is smooth and flat, and generally no subsequent processing is required, so the cutting quality is high;
(2) : The heat affected zone is small and can be ignored, the plate deformation is small, and the slit is narrow (0.1mm~0.3mm);
(3) : High processing precision, good repeatability, manpower saving, convenient and fast, without damaging the material surface;
(4) : Automatic vision system, automatic positioning, more accurate cutting;
(5) : Double end synchronous processing, improve cutting efficiency, no need to open a mold, economical and time-saving;
(6) : The notch is free of mechanical stress and shearing burr;
(7) NC programming, can process any plan, can cut the whole board with large format, and facilitate the cutting of various materials

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